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Japan silicon edge grinding equipment

The requirement for the wafer quality is getting higher and the condition of wafer edge is getting more important. The edge grinders “W-GM series” process edge grinding of various kind of materials such as Silicon, sapphire and SiC.As a solution for that, Our W-GM series are highly rated among manufactures of silicon, compound materials and other wafer shaped materials

  • Control in Semiconductor Wafer Manufacturing
    Control in Semiconductor Wafer Manufacturing

    silicon, ingots, are sliced into wafers, ground to a specific thickness (e.g., 300 mm diameter wafers are 0.775 mm thick) and polished to be smooth. A thin layer of epitaxial (i.e., single crystal) silicon, or “epi”, is deposited using CVD and the wafer is ready for use in a fabrication facility (commonly called a fab). All the transistors

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  • Grinding Machines - Products | Komatsu NTC Ltd
    Grinding Machines - Products | Komatsu NTC Ltd

    Fukuno Plant. 641 Nojiri, Nanto City, Toyama 939-1502, Japan Tel +81-763-22-2165 Fax +81-763-22-6218

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  • High Precision Polishing Service by the number one
    High Precision Polishing Service by the number one

    Polishing-affiliated process such as laser marking, edge-grinding, glass cutting, dicing, chamfering, metal vapor deposition, etc. are also offered with high precision. Surface processing technology such as epitaxial growth, etching, etc. are also materialized in our process with highly sophisticated level

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  • Okamoto Machine Tool Works,Ltd
    Okamoto Machine Tool Works,Ltd

    [ Head Office / Annaka factory ] 2993 Gobara,Annaka,Gunma,379-0315 JAPAN. TEL:027-385-5800 FAX:027-385-5880

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  • Semiconductor Manufacturing
    Semiconductor Manufacturing

    Wafer Edge Grinding Machine Highly accurate wafer edge grinding Machine for φ50 mm to 200 mm, 300 mm, and 450 mm wafer production. It is used in production lines of all over the world

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  • Revasum | Semiconductor Grinding Technology
    Revasum | Semiconductor Grinding Technology

    Our product portfolio includes grinding, polishing and CMP equipment used to manufacture substrates and devices for the global semiconductor industry. The Company has leveraged its significant intellectual property portfolio to develop the new flagship 6EZ Silicon Carbide Polisher, which, alongside the 7AF-HMG Silicon Carbide Grinder, provides

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  • Silicon Wafer Production Process | GlobalWafers Japan
    Silicon Wafer Production Process | GlobalWafers Japan

    In small diamter wafering process, wafers are sliced one by one from the ingot using a rotating diamond inner peripheral blade. The image shown on left is slicing with wire-saw. Beveling (Peripheral Rounding) The periphery of a wafer is ground with a diamond tool to attain the required product diameter

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  • Eighty-Year-Old Japanese Firm May Be Key to Next
    Eighty-Year-Old Japanese Firm May Be Key to Next

    Jun 29, 2021 (Bloomberg) -- One Japanese company that got its start making grinding wheels for machinery more than 80 years ago believes it holds the key to helping manufacturers create ever slimmer and more powerful semiconductors to power next-generation

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  • SiC Wafer Grinding - Engis
    SiC Wafer Grinding - Engis

    Grinding; Lapping (1 or 2 steps) Polish and Chemical-Mechanical Polishing (CMP) Silicon Carbide Wafer Grinding. The EVG-250/300 series Vertical Grinding Machine combined with Engis MAD Grinding Wheels can achieve a superior surface finish on silicon carbide wafers to reduce or even eliminate loose abrasive lapping steps

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  • Semiconductor Manufacturing Equipment
    Semiconductor Manufacturing Equipment

    Wafer Edge Grinding Machine Highly accurate wafer edge grinding Machine for φ50 mm to 200 mm, 300 mm, and 450 mm wafer production. It is used in production lines of all over the world

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  • Japanese firm bets on 3D packaging as key to next-gen chip
    Japanese firm bets on 3D packaging as key to next-gen chip

    Jun 30, 2021 Sekiya’s grandfather founded the company in 1937 to cash in on demand for grinding equipment amid Japan’s pre-war military build-up. After the war, Disco’s abrasive wheels found use in

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  • Customer Support|Semiconductor Manufacturing Equipment
    Customer Support|Semiconductor Manufacturing Equipment

    2968-2, Ishikawa-machi, Hachioji-shi, Tokyo (Tokyo Seimitsu Hachioji Plant), 192-0032 Japan TEL: (042) 631-5211 FAX: (042) 631-5234 Semiconductor Manufacturing Equipment Service Station Tokyo Office

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  • Fujimi Corporation
    Fujimi Corporation

    COMPOL - Silicon and Exotic Material Polish. COMPOL is a colloidal silica slurry developed especially for polishing metals, ceramics, and electronic substrates such as lithium tantalate (LiTaO3), lithium niobate (LiNbO3), and sapphire. Read More

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  • Equipment
    Equipment

    Auto Board Washing. Auto DFR Lamination. Auto Silk Printing. Auto Wet Film Coating. CNC Routing. Developping. Volcano Ash Grinding. Vaccum Packaging. Pattern Plating

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  • Lapping and Polishing Basics - South Bay Tech
    Lapping and Polishing Basics - South Bay Tech

    2.1: Grinding Grinding can be defined as the rapid removal of material from a sample either to reduce it to a suitable size or to remove large irregularities from the surface. The grinding wheel or plate typically rotates at a high speed (around 200-1000rpm) and a coarse, bonded abrasive ( 40 m) is used

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  • Friedrich Kollenrott Sharpening chisel and plane
    Friedrich Kollenrott Sharpening chisel and plane

    as ever by hand and by now with Japanese water stones – caused me problems for a long time, because regrettably I had neither an instructor nor clear instructions. I never quite got on terms with a

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  • Bulletin of the Japan Society of Precision Engineering
    Bulletin of the Japan Society of Precision Engineering

    This paper presents a new grinding method in which a silicon wafer rotating at high speed is ground by a cup wheel that is fed inward continuously. The paper compares experimental results by this

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  • Introduction to Semico nductor Manufacturing and FA
    Introduction to Semico nductor Manufacturing and FA

    Oct 06, 2017 • Silicon is the seventh-most abundant element in the universe ... and Grinding 5. Slicing 6. Edge Rounding 7. Lapping 8. Etching(Chemical Polishing) 9. Polishing 10. Cleaning 11. Inspection 12. Packing / Shipping ... Test Equipment Bin 1: Good Quality Devices

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  • Grinding and Polishing Guide | Buehler
    Grinding and Polishing Guide | Buehler

    Grinding and Polishing Guide. Grinding should commence with the finest grit size that will establish an initially flat surface and remove the effects of sectioning within a few minutes. An abrasive grit size of 180-240 [P180-P280] is coarse enough to use on specimen surfaces sectioned by an abrasive wheel. Hack-sawed, bandsawed, or other rough

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  • Glass Grinding Machine on sales - Quality Glass Grinding
    Glass Grinding Machine on sales - Quality Glass Grinding

    Auto Solar Panel Making Machine PV Module Glass Edge Grinding Machine Specifications: Model YEPC6M1300 YEPC6M1600 YEPC6M2000 YEPC6M2500 Max. Width of Glass 1300mm 1600mm 2000mm 2500mm Min. Size of Glass 120

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